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 PD -50055B
GA100TS60U
"HALF-BRIDGE" IGBT INT-A-PAK
Features
* Generation 4 IGBT technology * UltraFast: Optimized for high operating frequencies 8-40 kHz in hard switching, >200 kHz in resonant mode * Very low conduction and switching losses * HEXFREDTM antiparallel diodes with ultra- soft recovery * Industry standard package * UL recognition pending
Ultra-FastTM Speed IGBT
VCES = 600V VCE(on) typ. = 1.6V
@VGE = 15V, IC = 100A
Benefits
* Increased operating efficiency * Direct mounting to heatsink * Performance optimized for power conversion: UPS, SMPS, Welding * Lower EMI, requires less snubbing
Absolute Maximum Ratings
Parameter
VCES IC @ TC = 25C ICM ILM IFM VGE VISOL PD @ TC = 25C PD @ TC = 85C TJ TSTG Collector-to-Emitter Voltage Continuous Collector Current Pulsed Collector Current* Peak Switching Current Peak Diode Forward Current Gate-to-Emitter Voltage RMS Isolation Voltage, Any Terminal To Case, t = 1 min Maximum Power Dissipation Maximum Power Dissipation Operating Junction Temperature Range Storage Temperature Range
Max.
600 100 200 200 200 20 2500 320 170 -40 to +150 -40 to +125
Units
V A
V W C
Thermal / Mechanical Characteristics
Parameter
RJC RJC RCS Thermal Resistance, Junction-to-Case - IGBT Thermal Resistance, Junction-to-Case - Diode Thermal Resistance, Case-to-Sink - Module Mounting Torque, Case-to-Heatsink Mounting Torque, Case-to-Terminal 1, 2 & 3S Weight of Module
Typ.
-- -- 0.1 -- -- 200
Max.
0.38 0.70 -- 4.0 3.0 --
Units
C/W N.m g
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1
4/24/2000
GA100TS60U
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)CES VCE(on) VGE(th) VGE(th)/TJ gfe ICES VFM IGES Parameter Collector-to-Emitter Breakdown Voltage Collector-to-Emitter Voltage Min. Typ. Max. Units Conditions 600 -- -- VGE = 0V, IC = 1mA -- 1.6 2.1 VGE = 15V, IC = 100A -- 1.6 -- V VGE = 15V, IC = 100A, TJ = 125C Gate Threshold Voltage 3.0 -- 6.0 IC = 500A Temperature Coeff. of Threshold Voltage -- -11 -- mV/C VCE = V GE, IC = 500A Forward Transconductance -- 107 -- S VCE = 25V, I C = 100A Collector-to-Emitter Leaking Current -- -- 1.0 mA VGE = 0V, VCE = 600V -- -- 10 VGE = 0V, VCE = 600V, TJ = 125C Diode Forward Voltage - Maximum -- 3.6 -- V IF = 100A, VGE = 0V -- 3.5 -- IF = 100A, VGE = 0V, TJ = 125C Gate-to-Emitter Leakage Current -- -- 100 nA VGE = 20V
Dynamic Characteristics - TJ = 125C (unless otherwise specified)
Qg Qge Qgc td(on) tr td(off) tf Eon Eoff (1) Ets (1) Cies Coes Cres trr Irr Qrr di(rec)M/dt Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Energy Turn-Off Switching Energy Total Switching Energy Input Capacitance Output Capacitance Reverse Transfer Capacitance Diode Reverse Recovery Time Diode Peak ReverseCurrent Diode Recovery Charge Diode Peak Rate of Fall of Recovery During tb Min. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ. 443 86 150 168 145 320 242 4.0 7.0 11 9837 615 128 143 95 6813 1883 Max. Units Conditions 664 VCC = 400V 129 nC IC = 66A 225 TJ = 25C -- RG1 = 27, RG2 = 0 -- ns IC = 100A -- VCC = 360V -- VGE = 15V -- mJ -- 17 -- VGE = 0V -- pF VCC = 30V -- = 1 MHz -- ns IC = 100A -- A RG1 = 27 -- nC RG2 = 0 -- A/s VCC = 360V di/dt1300A/s
2
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GA100TS60U
100
F o r b o th :
80
LOAD CURRENT (A)
D u ty c y c le : 5 0 % TJ = 1 2 5 C T sink = 9 0 C G a te d riv e a s s p e c ifie d
P o w e r D is s ip a tio n = 73 W S q u a re w a v e : 60 % of ra ted vo ltag e
60
40
I
Id e a l d io d e s
20
0 0.1 1 10 100
f, Frequency (KHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
1000
1000
I C , Collector-to-Emitter Current (A)
I C , Collector-to-Emitter Current (A)
TJ = 125 o C
100
TJ = 25 C TJ = 125 C
100
TJ = 25 o C
10
10 0.8
V GE = 15 V 20s PULSE WIDTH
1.2 1.6 2.0 2.4
1 5 6 7
VVCE = 50V CC = 25V 5s PULSE WIDTH 80s PULSE WIDTH
8 9
VCE , Collector-to-Emitter Voltage (V)
VGE , Gate-to-Emitter Voltage (V)
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
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3
GA100TS60U
120 2.5 100
VCE , Collector-to-Emitter Voltage(V)
VGE = 15V 80 us PULSE WIDTH
Maximum DC Collector Current(A)
I C = 200 A
2.0
80
60
I C = 100 A
1.5
40
20
I C = 50 A
0 25 50 75 100 125 150
1.0 -60 -40 -20
0
20
40
60
80 100 120 140 160
TC , Case Temperature ( C)
TJ , Junction Temperature ( C)
Fig. 4 - Maximum Collector Current vs. Case Temperature
Fig. 5 - Typical Collector-to-Emitter Voltage vs. Junction Temperature
1
T h e rm a l Im p ed a n ce - Z th J C
D = 0 .5 0 0.20 0.10 0 .05 0.02 0.01 S in g le P u ls e (T h e rm a l R e sis ta n c e )
Notes: 1. Duty factor D = t
0.1
P DM
t 1 t2
1
/t
2
2. Peak TJ = PDM x Z thJC + T C
0.01 0.0001
0.001
0.01
0.1
1
10
100
1000
t 1 , R e c ta ng ular Pu lse D u ra tio n (S e co n d s )
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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GA100TS60U
20000
16000
VGE , Gate-to-Emitter Voltage (V)
VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc
20
VCC = 400V I C = 66A
16
C, Capacitance (pF)
Cies
12000
12
8000
8
Coes
4000
Cres
4
0 1 10 100
0 0 100 200 300 400 500
VCE , Collector-to-Emitter Voltage (V)
QG , Total Gate Charge (nC)
Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage
Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage
18
Total Switching Losses (mJ)
Total Switching Losses (mJ)
V CC = 360V V GE = 15V 125C TJ = 25 C 16 I C = 100A
100
RG =15;RG2 = 0 G1 = Ohm VGE = 15V VCC = 360V IC = 200 A
14
IC = 100 A
10
12
IC = 50 A
10
8 10 20 30 40 50
1 -60 -40 -20
0
20
40
60
80 100 120 140 160
RG G1Gate Resistance (Ohm) R , , Gate Resistance ()
TJ , Junction Temperature ( C )
Fig. 9 - Typical Switching Losses vs. Gate Resistance
Fig. 10 - Typical Switching Losses vs. Junction Temperature
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5
GA100TS60U
30
RG =15;RG2 = 0 G1 = Ohm
300
Total Switching Losses (mJ)
T J = 150 C VCC = 0V 25 VGE = 15V
20
250
V G E = 20V T J = 125C V C E m easured at term inal (Peak V oltage)
200
15
150
SAFE O PERATING AREA
10
100
5
50
0 0 40 80 120 160 200
0 0 100 200 300 400 500 600
A
700
I C , Collector-to-emitter Current (A)
VCE , Collector-to-Emitter Voltage (V)
Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current
1000
Fig. 12 - Reverse Bias SOA
12000
I F = 2 00 A
In sta n ta n e o u s F o rw a rd C u rre n t - I F (A )
10000
I F = 1 00 A I F = 5 0A
8000
100
Q R R - (nC )
T J = 125C T J = 25C
6000
4000
2000
VR = 36 0 V TJ = 12 5 C TJ = 25 C
10 1.0 2.0 3.0 4.0 5.0
0 500
1000
1500
2000
F o rwa rd V o lta g e D ro p - V FM (V )
di f /dt - (A /s)
Fig. 13 - Typical Forward Voltage Drop vs. Instantaneous Forward Current
Fig. 14 - Typical Stored Charge vs. dif/dt
6
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GA100TS60U
240 150
VR = 3 6 0V TJ = 1 25 C TJ = 2 5C
I F = 2 00 A I F = 1 00 A I F = 50 A
120
I F = 2 00 A I F = 1 00 A I F = 50 A
200
I IR R M - (A )
t rr - (n s)
90
160
60
120 30
VR = 3 6 0 V T J = 1 2 5 C T J = 2 5 C
80 500 1000 1500 2000 0 500 1000 1500 2000
di f /dt - (A /s)
d i f /d t - (A / s )
Fig. 15 - Typical Reverse Recovery vs. dif/dt
Fig. 16 - Typical Recovery Current vs. dif/dt
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7
GA100TS60U
90% Vge +Vge
Vce
Ic
10% Vce Ic
9 0 % Ic 5 % Ic
td (o ff)
tf
Eoff =
t1 + 5 S V c e Ic Vceic d tdt t1
Fig. 17 - Test Circuit for Measurement of ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf
t1 t2
Fig. 18 - Test Waveforms for Circuit of Fig. 17, Defining Eoff,
td(off), tf
G A T E V O L T A G E D .U .T . 1 0 % +V g +Vg
trr Ic
Q rr =
trr id ddt Ic t tx
tx 10% Vcc Vce Vcc 1 0 % Ic 9 0 % Ic D UT VO LTAG E AN D CU RRE NT Ip k Ic
1 0 % Irr V cc
V pk Irr
D IO D E R E C O V E R Y W A V E FO R M S td (o n ) tr 5% Vce t2 Vce d E o n = V ce ieIc t dt t1 t2 D IO D E R E V E R S E REC OVERY ENER GY t3 t4
E re c =
t4 V d idIc t dt Vd d t3
t1
Fig. 19 - Test Waveforms for Circuit of Fig. 17,
Defining Eon, td(on), tr
Fig. 20 - Test Waveforms for Circuit of Fig. 17,
Defining Erec, trr, Qrr, Irr
8
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GA100TS60U
V g G A T E S IG N A L D E V IC E U N D E R T E S T C U R R E N T D .U .T .
V O L T A G E IN D .U .T .
C U R R E N T IN D 1
t0
t1
t2
Figure 21. Macro Waveforms for Figure 17's Test Circuit
RL= 0 - 480V
480V 4 X IC @25C
Figure 22. Pulsed Collector Current Test Circuit
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9
GA100TS60U
Notes:
Q Repetitive rating; VGE = 20V, pulse width limited by
max. junction temperature.
R See fig. 17 S For screws M5x0.8 T Pulse width 80s; single shot.
Case Outline -- INT-A-PAK
Dimensions are shown in millimeters (inches)
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000 IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111 IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086 IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630 IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936 Data and specifications subject to change without notice. 4/00
10
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